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Lead frame for lead-on chip with separated lead for power supply and lead-on chip package and lead-on chip package without lead for power-on lead without lead
Lead frame for lead-on chip with separated lead for power supply and lead-on chip package and lead-on chip package without lead for power-on lead without lead
The present invention relates to a lead frame for a lead-on chip and a lead-on chip package using the same. More particularly, the ends of adjacent power supply leads of the lead frame are divided into power supply busbars and split leads, respectively. By dividing into a plurality of chips, the power supply bonding pads are not formed in the center portion of the semiconductor chip while maintaining stable power supply, securing a desirable speed, and removing noise in the semiconductor chip package using the lead frame. When the semiconductor chip having the power supply bonding pads formed thereon is characterized in that the bus bar is removed.
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